Andrew Tay

Andrew Tay (M1991, SM2019, F2023) is currently a Visiting Scientist at the Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), National University of Singapore (NUS). Prior to this he was a Senior Research Fellow at the Singapore University of Technology and Design and Professor in the Department of Mechanical Engineering, NUS. He obtained his B.E. (Hons I and University Medal) and PhD in Mechanical Engineering from the University of New South Wales, Australia. His research interests include thermo-mechanical reliability, thermal management of electronics and EV battery systems, reliability of solar photovoltaic modules and fracture mechanics. To date he has published more than 250 technical papers, 4 book chapters, 7 keynote presentations, 11 invited presentations and 3 panel discussions.

Dr Tay was the General Chair of the 1st Electronics Packaging Technology Conference (EPTC) in 1997. In 2006 he was appointed the inaugural Chairman of the EPTC Board, and is currently serving as its Chairman. He has been in the Executive Committee of the IEEE Singapore RS/EPS/EDS Chapter since 2000 and was its Chairman from 2010-2011 and 2018-2019. He has been involved in the international advisory boards and program committees of many electronics packaging conferences including DTIP, ECTC, EMAP, EPTC, EuroSimE, HDP, ICEPT, IEMT, IMPACT, InterPack, ITHERM and THERMINIC.

He was an Associate Editor of the ASME Journal of Electronic Packaging, an editorial board member of several journals including Microelectronics Journal and Finite Elements in Analysis and Design, and a guest editor of special issues of Microelectronics Reliability Journal, and Journal of Electronics Packaging. He is currently Co-Editor-in-Chief, Encyclopedia of Packaging Materials, Processes, and Mechanics.

He was a member of the EPS Education Committee from 1998 to 2007, and the coordinator of the Singapore Economic Development Board’s Specialized Manpower Program in Electronics Packaging and Wafer Fabrication in NUS. He has been awarded competitive research grants exceeding $14 Million for electronics packaging projects.

He was awarded the 2019 IEEE EPS David Feldman Outstanding Contribution Award, the 2012 IEEE EPS Exceptional Technical Achievement Award, the 2012 IEEE EPS Regional Contributions Award, the 2004 ASME Electronics & Photonics Packaging Division Engineering Mechanics Award, the 2000 IEEE Third Millennium Medal and the 2000 Special Presidential Recognition Award.